Microelectronic Packaging

Fülszöveg

MICROELECTRONIC PACKAGING
Interconnection and Assembly of Integrated Circuits
By GEORGE SIDERIS Senior Editor
Electro-Technology Magazine formerly Senior Editor, Applications, Electronics Magazine
Integrated circuits have virtually erased the traditional dividing lines between the technologies that contribute to the development and production of electronic systems.
This highly practical volume is designed to help the engineer and designer bridge the gap between electrical and mechanical design and manufacturing methods. An excellent guide for everyone faced with practical design problems, it details the design and fabrication considerations that have to be evaluated when a new design is undertaken.
Based on 35 recent articles in Electronics, the book explores the special design and production methods that have been originated, and are actually used, in industry today. It pinpoints new packaging and assembly techniques generated by the development of IC's and explores the... Tovább

Fülszöveg

MICROELECTRONIC PACKAGING
Interconnection and Assembly of Integrated Circuits
By GEORGE SIDERIS Senior Editor
Electro-Technology Magazine formerly Senior Editor, Applications, Electronics Magazine
Integrated circuits have virtually erased the traditional dividing lines between the technologies that contribute to the development and production of electronic systems.
This highly practical volume is designed to help the engineer and designer bridge the gap between electrical and mechanical design and manufacturing methods. An excellent guide for everyone faced with practical design problems, it details the design and fabrication considerations that have to be evaluated when a new design is undertaken.
Based on 35 recent articles in Electronics, the book explores the special design and production methods that have been originated, and are actually used, in industry today. It pinpoints new packaging and assembly techniques generated by the development of IC's and explores the impact of these techniques on the design of electronic circuits and systems. Encompassing the ideas of many engineers, and the ways in which they are applied in practice, the book . . .
• surveys problems and solutions which affect packaging design trade-offs, including size; weight; cost; reliability; modular, mechanical, and electrical design; manufacturing methods; and trends in IC and packaging design.
• covers electrical design of interconnection structures, such as multilayer boards and IC wiring patterns, and the relationship between system and interconnection design.
• outlines microwelding techniques developed to connect IC's to printed circuits, and other forms of interconnection structures.
• explores custom integrated-circuit design and fabrication, with emphasis on analog circuits.
Primarily concerned with custom and hybrid IC's, this volume is of particular interest to all electronics circuit and system designers . . . electronic packaging engineers . . . and manufacturing and process engineers in the electronics industry. Vissza